SMT Process Introduction

SMT is called Surface Mount Technology and is the latest assembly soldering technology in the current processing of electronic components and PCBs. The assembly welding method is to use a screen printer to print the paste on the pad (PAD) of the PCB, and then mount the SMD component using a mount (eg, resistor, capacitor, inductor, diode). , TFTs, integrated circuits (ICs), etc., and then reflow soldering (REFLOW) to melt the solder paste, so that electronic components and PCB-PAD combined to complete the assembly and welding technology.

Has three SMT production lines, through the anti-error material system to prevent the situation of the wrong materials, in addition to AOI optical testing equipment to control the production quality and the inspection personnel in the second inspection, greatly improved production quality.

Receiving/Sending machine SCLD-66
Generally used in the SMT process, the front end and the last end of the line body.

Mounter (high speed machine)
The front and rear heads are directly connected to each other to achieve the industry's top sequential placement speed. Each of the placement heads is capable of absorbing all of the front and rear components, thereby increasing the degree of freedom of optimization and achieving high productivity with a minimum line body configuration.

Solder paste printing inspection machine SPI
For the high-speed production line, the industry-leading V-series is faster.
A large-scale online solder printing inspection machine that pursues high speed, high precision, and simple operation.

Automatic printing machine MINAMI
Through the automatic printing machine, the position and amount of solder paste after each printing can be maintained.
In addition to improving the overall printing quality, the problems caused by human printing are also eliminated. And greatly improve the stability, precision and high quality of production.

Mounter (general machine)
A chip mounter that is suitable for high-speed placement of small components. Not only does the laser recognition component have a wide range of requirements, but also the MNVC option enables high-precision image recognition of small IC components and supports flexible and flexible production lines.

Mounter (medium speed machine)
A chip mounter that is suitable for high-speed placement of small components.
Not only does the laser recognition component have a wide range of requirements, but also the MNVC option enables high-precision image recognition of small IC components and supports flexible and flexible production lines.

Reflow furnace
Forced hot air convection heating module.
The low-quality nickel-chromium heater has a fast heating reaction and good thermal compensation.

AOI optical inspection machine
High precision, no manual visual inspection, limited detection by wires/components, fast detection speed and low error rate.

HELLER N2 Reflow Oven
SMT Reflow add N2 can reduce welding surface oxidation and improve welding quality.

X-Ray Inspection Equipment
X-Ray inspection equipment can inspect the quality of soldered parts on PBCA and it’s can inspect that Aoi cannot inspect components. For example, BGA component and other component damage analysis.

3D AOI (3D Automatic Optical Inspection Machine)
2D AOI only inspect for depression angle but 3D AOI can inspect side view. For example, fake solder under IC pin, soldering status of BT module side and it’s can inspect component solder empty and solder insufficient.