DIP Process Introduction

The DIP process is a Dual In Line Package Process. It is a processing process that combines traditional electronic components and PCBs. The modern new electronic products tend to be light and thin, so most of the DIP parts have been gradually Replaced by SMD parts. The DIP package can be mounted on a circuit board using a plug-in packaging technique, or it can be mounted using a DIP socket. The use of a DIP socket facilitates the replacement of components and also avoids overheating of components during soldering. The general socket will be used with a larger integrated circuit.

In addition, the introduction of the automatic spot welder by Juyi successfully solved the shortage of hand welding technicians, reduced costs, and successfully improved the quality, efficiency, and technology.